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5961-00-001-7419

Semiconductor Device Assembly

5961000017419 000017419 27.7910.0014 27-7910-11

A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE. View more Semiconductor Device Assembly

5961-00-001-7419 SEMICONDUCTOR DEVICE ASSEMBLY 5961000017419 000017419

Managed by United States
NSN Created on 4 Apr 1973
Data Last Changed
January 2023
NATO Update Count
5
NATO Data Quality
5961-00-001-7419 SEMICONDUCTOR DEVICE ASSEMBLY 5961000017419 000017419 1/1
NSN 5961-00-001-7419 (Generic Image) 1/1

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5 24 Sep 1972 5945-00-001-7418 Contact Wiper 21-5559-1RNCC: 3 | RNVC: 9 | DAC: 5 24 Sep 1972 5961-00-001-7419
5999-14-218-6570 5999142186570 142186570 is an item consisting of an electrically conductive material designed to furnish a surface which will physically and electrically meet another conducting surface for the purpose of transferring electrical energy and/or opening and closing circuits. includes moving contacts which make and/or slide over stationary contacts or other stationary conductive material to a resulting fixed position. excludes items which are used in conjunction with continually moving surfaces or which make contact by gripping action of the contact surfaces. see also clip, electrical; clamp, electrical; brush, electrical contact; plug, tip; and jack, tip.

5961-00-001-7419 Demil Restrictions 5961-00-001-7419

DEMIL: A | DEMILI: 1 | CRITICALITY: X | HMIC: N | PMIC: U | EDC: | ADPEC:

5961-00-001-7419 is a Semiconductor Device Assembly that does not have a nuclear hardened feature or any other critical feature such as tolerance, fit restriction or application. Demilitarization of this item has been confirmed and is not currently subject to changes. This item is considered a low risk when released from the control of the Department of Defense. The item may still be subject to the requirements of the Export Administration Regulations (EAR) and the Code of Federal Regulations (CFR). This item is not suspected to be hazardous. The precious metals content of this item is unknown.

5961-00-001-7419 HTS and ScheduleB Import and Export 5961-00-001-7419

5961-00-001-7419 Stock, Inventory and Procurement DLA Procurement Analysis 5961-00-001-7419

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5961-00-001-7419 Management Data Management Data 5961-00-001-7419

Effective Date
Organization
Unit of Issue
Unit Price
Qty Unit Pack
Oct 2022
Department of the Navy (DN)
EA
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1
Oct 2021
Department of the Navy (DN)
EA
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1
Oct 2020
Department of the Navy (DN)
EA
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1
Oct 2019
Department of the Navy (DN)
EA
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1

Navy Navy

Cognizance:
9B
Navy-owned stocks of DLA material
Naval Inventory Control Point, Mechanicsburg

5961-00-001-7419 Related Items NATO Stock Numbers Related to 5961-00-001-7419

5961-00-001-7419 Contracting Technical Data File (CTDF) Contracting Technical Data File (CTDF) 5961-00-001-7419 October 2021

Criticality and Quality

Critical Item Code:
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Commercial Properties

Government Furnished Material:
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Restrictions

Boeing Rights Guard:
Export Controlled:
Controlled Technical Data Package (TDP):
Restricted Technical Data Package (TDP):
Contains Classified Material
Weapons System Indicator Code (WSIC):
N

Packaging Requirements

Packaging Determination Table:
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Pallet Reference Number Required: